ANATECH SP 100 uses oxygen as a plasma gas while the plasma is generated using a RF generator. Chamber size 4? in dia and 8? long. It is used for removing organic contaminants and traces of photoresist residue of developed/patterned substrates.

Brewer Science spin coat-bake combination system combines a track-quality precision spin coater with a high-uniformity bake plate, all in an efficient, space-saving design. This spin coat-bake system can accommodate 3, 4 and 6-inch wafers.

Clean room access

The Dektak 3ST is a 2D contact profilometer used to provide quantitative information about step heights and surface roughness for thin and thick films measurements.

The E- beam deposition system is a custom build system in a long throw configuration with 4 pockets (6cc/pocket) for sequential evaporation of various materials. The system can accept both 3(5 at a time) and 4-inch(4 at time) substrates.

Electroplating/Lift Off Bench: Bay 3

The EVG610 can handle small substrate pieces and wafers up to 100 mm. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications.

The?Laurell??spin?coater?is compact and packed with advanced features.?The coater system will accommodate up to??150mm wafers and 5"??5" substrates, and features a maximum rotational speed of?12,000?RPM (based on a??100mm silicon wafer).

MRC 8667 is an automated cylindrical chamber R&D batch sputtering systems feature horizontal "Sputter Down" mode of sputtering in three target positions, DC magnetron, RF magnetron mode capabilities at each target position.

Nanospec works on the principle that intensity of monochromatic reflected light depends strongly on film thickness. It uses a computer-controlled grating monochromator and a photomultiplier tube detector to measure the reflected optical spectrum.

Nikkon Optiphot 200 Fluorescent microscope is a wafer inspection microscope with Bright-field /Dark-field illumination capability having objectives up to 150X. It has a eye piece at 10X thereby rendering the system with a maximum magnification of 1500X.

The Oxford system is a load-locked inductively coupled plasma etch tool that uses RF (600 watts 13.56MHz) for the RIE water-cooled electrode and 1.2 kW, 2 MHZ on the ICP driven electrode. The system currently uses Chlorine and Boron tri-chloride gases.

Phoenix 150 Contact angle measurement system provides quick and accurate contact angle/surface energy measurements of the wafer surface to adhesion, cleanliness and surface treatments.

Photo bay

Pre-diffusion Clean Bench: Bay 1

The Quintel Q4000 Mask Aligner combines innovative design with precision alignment and exposure features. It supports both vacuum and contact printing and handles partial and whole substrates up to 150mm (6?) diameter.

The Savannah 100 is an atomic layer deposition (ALD) tool used for growing conformal layers of thin films, atomic layer by layer. This tool can handle small pieces up to 4" wafers. Precursors for growing HfO2, ZrO2, TiO2 and Al2O3 are available.

The SCS Parylene deposition system is capable of applying conformal coating of Parylene with thickness ranging from a few hundred nanometers up to 75 microns. It can accept chips and wafers as large as 6 inch (12 wafers/per process) for processing.

Thermal Evaporater

The Uniaxis Plasma 790 is used to etch various materials, such as silicon dioxide, silicon nitride, and various polymers from the surface of a substrate using several reactive gases in a RF induced plasma. Wafer sizes up to 6 inches can be accepted.

The Veeco NEXUS IBE systems are used for many applications including the process of precisely etching metallic films to create the magnetic sensors used for a wide variety of mobile, automotive, MRAM, and hard disk drive devices. ?

Wet Etch Bench: Bay 2

Ellipsometer used to analyze thin film structural and optical properties including thickness, segregation character of multicomponent films, and complex refractive indices. An ellipsometer can be used you measure layers as thin as 1nm up to microns thick.

XACTIC e1 uses XeF2 gas to isotropically dry etch silicon, germanium, and molybdenum for creating/releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, SiO2, Si3N4 and Al.

NewView 6000 is an optical profiler for characterizing and quantifying surface roughness, step heights, critical dimensions, and other topographical features. All measurements are nondestructive, fast, and require no sample preparation.

This manually operated four point probe instrument measure the average resistance of a thin layer or sheet by passing current through the outside two points of the probe and measuring the voltage across the inside two points.

Electrical Probe Station

The Nanometer Pattern Generation System (NPGS) provides a user-friendly environment for the delineation of complex structures using a commercial electron microscope. NPGS is designed to be extremely flexible, yet easy to use.

The LC-1 glovebox system is a complete full size stand alone glovebox. It achieves and maintains less than 1ppm water and oxygen inert gas environment. It is modular and includes the stand, gloves, lighting, antechamber, quick release window.

MicroAutomation 1006 is for dicing wafers into chips for packaging. It is capable of dicing up to 150 mm diameter wafers while the air bearing spindle speed can be adjusted between 10,000 to 40,000 rpm.

MEI is used to bond chips to holders for quick functionality testing and packaging. The bonding process is based on thermocompression or thermosonic ball bonding using gold wire. The system can handle wire diameters from 17um to 75um.

Mini brute furnace is a single tube furnace operating at temperature range 400C-1300C and is used for annealing materials with forming gas. The tube has a maximum size of 6" OD with a 3 zone controller, uniform heated zone between 400-800C.

PANalytical X'Pert Pro MPD, powered by a Philips PW3040/60 X-ray generator and fitted with an X'Celerator* detector. Diffraction data is acquired by exposing powder samples to Cu-K? X-ray radiation, which has a characteristic wavelength of 1.5418 ?.

Park XE7 provides accurate measurement at highest nanoscale resolution due its flat, orthogonal, and linear scan measurements by its unique AFM architecture: independent XY and Z, flexure based scans.

The Perkin-Elmer 2400 system is three target magnetron-sputtering system with capability of performing sequential deposition from DC magnetron, RF magnetron and conventional RF cathodes.

Sputter Coater

The SUPRA 25 FESEM uses a unique GEMINI field emission column for delivering superb nanometer resolution over the complete accelerating voltage range (100eV-30KeV) thus requiring minimal adjustments over the full operating voltage range.

Tousimus Critical Point Dryer

The Zyvex NanoWorks is a manipulation and testing tool used with a scanning electron microscope (SEM) or a focused ion beam (FIB) system for microand nanoscale research and development applications.